-718953805.jpg "Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)")
Beschreibung
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials) im Online-Buchhandel:
-718953601.jpg "Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)")
Bewerte das Buch
- Habe ich gelesen
- Möchte ich noch lesen
- Lieblingsbücher
- Wunschliste
-741557821.jpg "Textiles and Fashion: Materials, Design and Technology (Woodhead Publishing Series in Textiles, Band 126)")
-von-Fellows,-P.J-668958107.jpg "Food Processing Technology: Principles and Practice (Woodhead Publishing Series in Food Science, Technology and Nutrition)")
-737114517.jpg "Hygienic Design of Food Factories (Woodhead Publishing Series in Food Science, Technology and Nutrition)")
-747913583.jpg "Colour Measurement: Principles, Advances and Industrial Applications (Woodhead Publishing Series in Textiles)")
-von-Ravindra-743719316.jpg "Microbolometers: Fundamentals, Materials, and Recent Developments (Woodhead Publishing Series in Electronic and Optical Materials)")
-750121274.jpg "Advanced Piezoelectric Materials: Science and Technology (Woodhead Publishing Series in Electronic and Optical Materials)")
-749613668.jpg "Cheese Problems Solved (Woodhead Publishing Series in Food Science, Technology and Nutrition)")
-von-Rogers,-Lauren-740848366.jpg "Sensory Panel Management: A Practical Handbook for Recruitment, Training and Performance (Woodhead Publishing Series in Food Science, Technology and Nutrition)")