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Beschreibung
EMBEDDED COOLING OF ELECTRONIC DEVICES: Conduction, Evaporation, and Single- and Two-Phase Convection (WSPC in Advanced Integration and Packaging, 8, Band 8)
EMBEDDED COOLING OF ELECTRONIC DEVICES: Conduction, Evaporation, and Single- and Two-Phase Convection (WSPC in Advanced Integration and Packaging, 8, Band 8) von Madhusudan Iyengar, Justin A Weibel Meh im Online-Buchhandel:
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